JSDQ Electronic Material Technology Co., Ltd. was established in 2000. It is a professional company engaged in the R&D, manufacturing and sales of microelectronic packaging Metal Matrix Composites:tungsten copper metal composite material, molybdenum copper composite material, copper/molybdenum/copper and copper/molybdenum copper/copper sandwich structure composite materials…
Products
Tungsten copper composite material
The tungsten-copper heat sink material produced by the company is a composite material of tungsten and copper, which has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. Especially valuable is that its thermal expansion coefficient and thermal conductivity can be adjusted by The composition of the material is designed (in technical terms, its performance is tailorable), which brings great convenience to the application of the material. It can form a good thermal expansion match with the following materials:
(1) Ceramic materials: Al2O3 (A-90, A-95, A-99), BeO (B-95, B-99), AlN, etc.
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP, and AlGaAs, etc.
(3) Metal materials: Kovar alloy (4J29), 42 alloy, etc.
Product introduction of tungsten copper heat sink material:
By adjusting the proportion of tungsten composition, its thermal expansion coefficient can form a good thermal expansion ratio with other materials, such as various types of ceramics (alumina Al2O3, beryllium oxide (BeO), metal materials (Kovar) Kovar) and semiconductor materials (silicon carbide Sic )and many more.
Tungsten copper heat sink material product features:
Without adding sintering activation elements such as Fe and Co, it can maintain high thermal conductivity
Can provide semi-finished products or finished products with Ni/Au plating on the surface
Excellent air tightness
Good dimensional control, surface finish and flatness
Copper/Molybdenum-Copper/Copper Composite
Similar to the copper/molybdenum/copper composite material, copper/molybdenum-copper/copper is also a sandwich structure. It is composed of two sub-layers—copper (Cu) and a core layer—molybdenum-copper alloy (MoCu). The Y area has different coefficients of thermal expansion. Compared to tungsten copper, molybdenum copper, and copper/molybdenum/copper materials, copper/molybdenum copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively competitive price.
Features of copper/molybdenum-copper/copper heat sink materials:
.Higher thermal conductivity than copper/molybdenum/copper composites
.Can be punched into parts to reduce costs
.The interface is firmly combined and can withstand 850℃ high temperature repeatedly
.Designable thermal expansion coefficient, matching with semiconductor and ceramic materials
.Non-magnetic
Copper Molybdenum Copper Composite
The company produces copper-molybdenum copper Cu/Mo/Cu heat sink material is a composite material similar to a sandwich structure, it is a core layer-molybdenum (Mo) wrapped by two secondary layers-copper (Cu), which has an adjustable thermal expansion coefficient , High thermal conductivity and high strength characteristics. Therefore, it is often used in some more important occasions, as a heat sink, lead frame and bottom expansion and heat conduction channel of multilayer printed circuit board (PCB).
Copper/molybdenum/copper Cu/Mo/Cu heat sink material product features:
.Can provide large-area plates (length 400mm, width 100mm)
.Can be punched into parts to reduce costs
.The interface is firmly combined and can withstand 850℃ high temperature repeatedly
.Designable thermal expansion coefficient, matching with semiconductor and ceramic materials
.Non-magnetic
Molybdenum copper (MoCu) composite material
The molybdenum-copper heat sink material produced by the company is a composite material of molybdenum and copper, and its performance is similar to that of tungsten-copper composite materials. Customized different thermal expansion coefficients of molybdenum copper (MoCu) can also be obtained by adjusting the composition ratio of molybdenum, because molybdenum Copper is much lighter than tungsten copper, so it is generally suitable for aerospace and other fields.
Molybdenum copper heat sink material product features:
.Without adding sintering activation elements such as Fe and Co, it can maintain high thermal conductivity
.Excellent air tightness
.Smaller density, more suitable for flying electronic equipment
.When the molybdenum content does not exceed 75%, rolled plates can be provided, which are biased towards punched parts
.Can provide semi-finished products or finished products with Ni/Au plating on the surface
Copper/Molybdenum-Copper/Copper Heat Sink Composite-Cu/Mo70Cu/Cu
Similar to the copper-molybdenum-copper (Cu/Mo/Cu) heat sink material, the copper/molybdenum-copper/copper heat sink material (copper/molybdenum-copper/copper heat sink sheet-Cu/Mo70Cu/Cu) is also a sandwich structure, which is composed of two A secondary layer-copper (Cu) wraps a core layer-molybdenum-copper alloy (MoCu), which has different thermal expansion coefficients in the X region and the Y region, compared to the tungsten copper (WuCu) heat sink material and molybdenum copper (MoCu). Heat sink materials and copper/molybdenum copper (Cu/Mo/Cu) heat sink materials, copper/molybdenum copper/copper (Cu/MoCu/Cu) heat sink materials have higher thermal conductivity and cost advantages.
Copper/Molybdenum/Copper heat sink metal composite material
Molybdenum copper heat sink metal composite material-Mo70Cu
Molybdenum copper heat sink metal composite material-Mo85Cu
Molybdenum copper heat sink metal composite material-Mo40Cu60
Tungsten copper heat sink metal composite material-W90Cu
Tungsten copper heat sink metal composite material-W85Cu
Tungsten copper thermal metal composite sink material-W80Cu
…
JSDQ has established and maintained close cooperative relations with more than 100 global customers from Fortune 500 companies including Boeing, Nokia, IBM, and General Dynamics…
In March 2020, American Space Exploration Technology Company (SpaceX) placed a purchase order for tungsten copper composite materials to JSDQ Electronic Material Technology Co., Ltd.
The Dragon spacecraft is developed by the space private enterprise-Space Exploration Technology Corporation (SpaceX). It is one of the few commercial spaceships in the world and the world's first spaceship developed by a private company. At 3:22 p.m. EDT on May 30, 2020, the first manned trial launch of NASA`s commercial manned aviation program was successful. The tungsten-copper composite material produced by JSDQ has been successfully used in the control system of Dragon Spacecraft.