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CRP Technology launches Windform® RS polyamide-based carbon fiber filled composite material

CRP Technology has launched a new type of polyamide-based carbon fiber filled composite material Windform® RS, which can be used for industrial production grade powder bed fusion (PBF) 3D printing. This top material has the characteristics of high tensile strength, high elongation at break and low density.

This new material belongs to the Windform® TOP-LINE series, which provides the strength, stiffness and ductility required for heavy-duty applications.

Franco Cevolini, CEO and Chief Technology Officer of CRP Technology, said: "We are committed to creating leading new composite materials for customers based on CRP Technology's expertise in the field of additive manufacturing."

Windform® RS has a high tensile strength (85.25 MPa), while having excellent ductility (elongation at break 9.46%) and low density (1.10g/cc).

Engineer Cevolini said: "So far, there is no material in the 3D printing market that can compete with Windform® RS. This material combines high resistance and high elasticity, which makes it unique in the world of additive manufacturing."

High elasticity/strength performance, so that it can withstand the impact of different temperature ranges, even below zero.

According to the UL 94 flammability test, Windform® RS has been rated as HB grade; in addition, this material still exhibits water resistance when the part thickness is only 1mm.

Windform®RS is an amazing advancement in the field of engineering materials, with durability, strength, and flexibility, providing new opportunities for a wide range of additive manufacturing applications.

Windform®RS is suitable for rugged, complex and detailed 3D printed PBF parts, rugged functional prototypes and heavy-duty terminal applications, and can withstand harsh environmental conditions.

Windform®RS is an ideal choice for custom production, pre-production parts and mission-critical components, suitable for high-demand industries such as aerospace, military, robotics, motorcycles, automobiles and ships.

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