JSHR Light Alloy Technology Co., Ltd. owns the core technology of "spray forming" and is a high-tech enterprise in China. The performance of the spray-formed high-performance aluminum alloy produced by the company is at the international advanced level, and the products have been successfully applied to many aircraft compressor series components in the Chinese aerospace industry, moon landing buffer devices, space station core cabin manipulators, and domestic large aircraft C919 wing long truss , Various national projects, vehicle chassis, heavy-duty locomotive axle box pull rods, etc., have made significant contributions to the lightweight of the above products. In addition, spray-formed aluminum-silicon electronic packaging materials are widely used in T/R components of aerospace phased array radars. The company has also successfully developed high-rigidity, light-weight and wear-resistant high-silicon alloys and a lightweight structural material of strategic significance to the country-aluminum-lithium alloy.

Products

Spray forming ultra-high strength aluminum alloy

The ultra-high-strength aluminum alloy manufactured by spray forming can effectively solve the problems of difficult casting, inability to forge, and serious segregation in the traditional technology. It can effectively eliminate macro segregation, make the structure uniform and fine, the grain fine, and improve the degree of alloying. 7055 aluminum alloy is a relatively high-strength alloy among deformed aluminum alloys, commonly known as "ace aluminum alloy", and is also an ultra-high-strength aluminum alloy with leading comprehensive performance registered in the United States. Various extrusions and forgings prepared from spray-formed 7055 aluminum alloy ingots are widely used, replacing traditional aluminum alloys, alloy steels, titanium alloys and other materials in structural parts, achieving a weight reduction of 20-60%.

Spray forming aluminum-lithium alloy

The ultra-high-strength aluminum alloy manufactured by spray forming can effectively solve the problems of difficult casting, inability to forge, and serious segregation in the traditional technology. It can effectively eliminate macro segregation, make the structure uniform and fine, the grain fine, and improve the degree of alloying. Aluminum-lithium alloy has excellent properties of high strength, high rigidity, and low density, and is an excellent material indispensable for lightweight structure.

Spray forming wear-resistant aluminum alloy

The high-silicon wear-resistant aluminum alloy prepared by spray deposition technology has the characteristics of small and uniform structure, uniform silicon crystal and intermetallic compound phase distribution, and can be extruded, heat-treated and strengthened, and has excellent mechanical processing properties, making high-silicon aluminum alloy materials The potential for superior tribological performance has been developed. The structure of high-silicon wear-resistant aluminum alloy materials contains high-hardness particle phases such as primary silicon and intermetallic compound phases. The finer these hard-point phases are, the more uniform the distribution, and the better the tribological performance; primary silicon content and transition alloy elements The higher the content, the more beneficial the tribological performance and high temperature performance. The ideal tribological surface has high hardness particles protruding, and the surrounding soft matrix forms pits. When friction occurs, the hard point phase plays the role of bearing force and wear resistance, and the surrounding pits have the functions of oil storage, lubrication and heat insulation.

Spray forming aluminum silicon alloy

The aluminum-silicon alloy prepared by spray forming is an excellent electronic packaging material, and high-silicon aluminum alloy materials with different properties can be obtained by adjusting the volume fraction of silicon. It has a low thermal expansion coefficient, low density, high thermal conductivity, and electrical conductivity. Good performance (with excellent electromagnetic interference / radio frequency interference shielding performance), high hardness, excellent thermo-mechanical stability, high compactness, easy machining, easy plating protection, compatibility with standard microelectronic assembly processes, etc.

Customize high performance alloys

Spray forming technology can effectively solve the problems of low performance and serious performance dispersion of existing alloys, and customize various alloy formulations according to customer needs.

· Break the limit of alloying degree and break the "island" alloy system.

·Develop new alloy formulas that exceed existing limits: various metals, strength, toughness, wear resistance, high temperature resistance, low thermal expansion, high stiffness, and fatigue.

The company`s main business is to use spray forming technology to develop and produce various grades of ultra-high-strength aluminum alloys (700MPa class, 800MPa class), and national strategic materials-aluminum-lithium alloys, aluminum-silicon materials, high-performance Special steel and other high-end alloy materials and products that are of great significance to the tools of the National Defense Forces.

Applications

Aerospace industry

Structural parts

Heat-resistant parts

fastener

Measuring instrument parts

RF microwave components

Optical components

...

Rail vehicle industry

Structural materials

Fastener

Body frame material

Body Link

Shock absorber

...

Automobile industry

piston

Rotor blade

Cylinder liner

Turbocharger

Hydraulic parts

fastener

Frame parts

Engine cylinder liner

clutch

Brake caliper

...

Electronic packaging and optical components

RF microwave packaging and carrier

T/R module

Aerospace vehicle electronic system

PCB circuit board substrate

High-power integrated circuit packaging

High-frequency circuit carrier and hermetic packaging

Power electronic devices (such as rectifiers, thyristors, power modules, laser diodes, microwave tubes, etc.

Microelectronic devices (such as computer CPU, DSC chip)

High brightness LED wafer

Electro-optical frame

Satellite base stations; mobile communication systems, etc.

Sensor housing and carrier

Laser system substrate and heat sink

Lens holder

...