On October 3, 2021, the semiconductor bonding wire production base built by the world's largest precision copper alloy wire manufacturer: ZJZW Electronic Materials Technology Corporation was officially put into production.
The project has a total investment of 2 billion yuan and covers an area of 200 acres. It mainly produces single crystal nano-copper and precious metal bonding wire products for semiconductor packaging.
The production base of key semiconductor packaging materials put into production this time has pioneered the world's fourth-generation intelligent robot collaborative production process, producing and developing bonding alloy wires, bonding silver alloy wires, bonding copper wires, bonding palladium copper wires and other packaging materials and nano New materials, etc. Among them, the high-end ultra-fine palladium-plated wire bonding wire has a diameter of only 13 microns, which is about one-tenth of that of a human hair, and is one of the highest grade metal bonding wires in the world.