Facing the technological trend of the development of international integrated circuits to three-dimensional microsystems in the post-Moore era and the major node of domestic advanced integrated circuits "must be in their own hands", SCMK Technology Co., Ltd. relies on Through-Glass Vias (TGVs) technology and passive integration (IPD) The leading advantage of technology research has developed into a high-tech enterprise focusing on TGV and IPD processing and solution provision.
The company relies on the State Key Laboratory of Electronic Thin Film and Integrated Devices of the University of Electronic Science and Technology of China, and has strong technical capabilities in glass/quartz based high aspect ratio microstructures, micro-nano vias, high aspect ratio filling, and thin film integrated devices. The R&D team has undertaken a number of major national, provincial and ministerial-level scientific research projects, and has successively won the National Innovation Competition Medal and the National Technology Invention Award. A production platform including core processes such as laser induction, through-hole etching, mid-ultraviolet lithography, film deposition, deep hole plating, grinding and polishing has been established, and it has passed ISO9001 quality system certification, and has applied for 26 patents/integrated circuit layouts. , Of which 12 are authorized.
At present, SCMK has formed a four-category product system of special glass materials, TGV generation processing, passive integrated devices, and TGV-related special process equipment. It is mainly used in three-dimensional packaging, microwave devices, microfluidic chips and other fields. , Aerospace Science and Technology, Chinese Academy of Sciences, BOE and other leading companies supply small quantities.
The company has established a pilot production platform for core processes including laser induction, through-hole etching, mid-ultraviolet lithography, film deposition, deep hole plating, grinding and polishing, and independently developed more than a dozen special micro-machining processes. It has become a qualified supplier of leading enterprises such as China Electric Power, Aerospace Science and Technology, Chinese Academy of Sciences, BOE, and the main provider of TGV technology and related products.
In March 2021, the company's TGV technology has a minimum through hole of 10 microns, reaching the current international leading level; in March 2021, the company's national-level project was successfully accepted; in April 2021, the company signed a strategic cooperation with Aerospace Communication Equipment Co., Ltd. Agreement to jointly develop thin film integration technology.