According to the comprehensive calculation of data provided by BCC research, the Chinese market for heat dissipation materials and electromagnetic shielding materials is expected to exceed 68 billion in 2025, with a compound growth rate of over 20% from 2020 to 2025. The demand for heat dissipation materials is in addition to chips in new energy vehicles, The fields of new energy power generation, smart mobile terminals, and smart wearable devices are growing particularly rapidly. The market for heat dissipation materials and heat dissipation solutions is expected to exceed 100 billion yuan in the future.
Hay Think has been paying attention to SZHJ Electronic Materials Technology Group, a comprehensive provider of heat dissipation materials and thermal solutions. Its R&D team integrates high-performance heat dissipation modules in the fields of international high-end servers, industrial lasers, consumer heat dissipation modules, and mobile phone products. The company's own mature experience in new materials provides customers with cost-effective comprehensive heat dissipation solutions from the complete machine level, and further realizes the substitution of localized materials and technical solutions in key heat dissipation technology areas.
At present, SZHJ not only provides high-performance, complete system of thermal conductive materials for chips and high-power electronic devices, but also has completed the layout of the entire industry chain in the field of heat dissipation through continuous research and development of heat dissipation solutions for high-density, high-power devices. Including system thermal design, structural design, thermal simulation analysis, custom development, comprehensive thermal testing and other levels to comprehensively manage the thermal runaway problem of high-density, high-power devices, from consulting and design to component product supply, and then to The integrated heat dissipation and temperature control of the whole machine provide a full set of solutions.
At the application level, customized development of thermal management solutions for customers' different processes is an effective way for SZHJ to enter the market. Its thermal design solution team has been officially operating for customers since March 2020. Team members have worked for Huawei and Motorola. The thermal management professional department has more than ten years of experience in the field of system-level heat dissipation and mature product development experience. From the manufacturing process to the software algorithm, a complete set of solutions can be delivered.
SZHJ can currently provide more than 300 kinds of heat dissipation solutions. In response to the heat dissipation requirements of high-end manufacturing scenes, combined with the size, shape, thermal expansion and deformation of customers' products, it provides customized products and adapted heat dissipation solutions, including chips , Lasers, consumer electronics, optical communications, new energy vehicles and other fields. In order to provide customers with more targeted services, the solution team has a complete set of work processes. While inputting the complete information of the project, it collects and analyzes competing products. After entering the conceptual design stage, the program design is carried out by analyzing the key parameters such as the cooling air volume of the key components and the system resistance. The company's self-developed professional simulation simulation test platform efficiently adjusts and optimizes the plan during the design process to ensure the rapid implementation of the client's plan.
In terms of technology, SZHJ has always focused on basic scientific research and breakthroughs. Chief scientist Academician Wang Chengbiao is one of the founders. His team has decades of accumulation and precipitation, covering nanomaterial preparation technology, diamond coating technology, and graphene in-situ vertical growth technology. , Thermal management technology, etc., the technical indicators of heat dissipation materials have reached the level of similar foreign products.
SZHJ also pays attention to the building of professional teams with interdisciplinary backgrounds. The current R&D team has many doctors from universities such as the University of California, Berkeley, McGill University, Tsinghua University, China University of Geosciences (Beijing), Beijing University of Aeronautics and Astronautics. It not only involves the direction of product research and development, but also covers the directions of basic disciplines such as physics, chemistry, and mathematics, and has rich experience in research and development and products in the field of polymer materials. At present, the company has applied for 4 invention patents, 19 utility model patents, 1 design patent and 12 soft works. These all constitute technical barriers to the company's core products.
In actual application scenarios, the heat dissipation market for chips mainly includes materials such as in-chip heat dissipation TIM1, off-chip heat dissipation TIM2 and metal heat dissipation materials; and heat dissipation solutions. For Huijing New Materials, off-chip heat dissipation materials and heat dissipation solutions have achieved short-term business breakthroughs; electromagnetic shielding materials, wave absorbing materials, and heat-dissipating metal materials are the medium-term business layout; on-chip heat dissipation materials are the long-term planning layout; by This forms a closed loop of the entire heat dissipation industry chain.
SZHJ pioneered a high-performance thermal conductive material based on diamond powder, which can break through the bottleneck of existing solutions and achieve a thermal conductivity of more than 17W/m·K, and there is still room for further improvement. Its high-performance thermal conductive particle development technology has great advantages in high thermal conductivity and ultra-high thermal conductivity application scenarios compared to the traditional technical route that uses aluminum oxide and aluminum nitride as thermal conductive particles. At present, the diamond route thermal conductive materials based on non-metallic substrates have been mass-produced. Combined with the explosion of the solution business in 2021, the company's revenue has grown rapidly.
At the same time, in order to improve the entire industry chain, SZHJ, in terms of heat dissipation metal materials and electromagnetic shielding materials, through strategic investment in Zhongnan New Materials and Guanxu New Materials, SZHJ not only improved the integrity of the industrial chain, but also greatly expanded its production capacity. Its cooling solution can cover more industry fields. Huijing New Materials plans to focus on the TIM1 product line in the next 4 years, with a total investment of about 190 million yuan, to fill the current domestic gap in this field. An important breakthrough in the localization of high-quality products.